Sn63/Pb37 Solder Paste 183°C SMD BGA SMT Tin Lead No Clean
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- Solder Paste Content: Alloy Tin 63% Tin / 37% Lead.
- Package Includes: 1 Can of Solder Paste, 50g/Can.
- Paste Features: Composition For Strong, Reliable Solder Joints With Excellent Wetting.
- Precise 183°C Melting Point: Low-Temperature Eutectic Formulation Melts Quickly And Evenly, Minimizing Thermal Stress On Sensitive Components.
- Applications: Widely Used in Circuit Board, lC, BGA /SMD Circuit Board,Motors, Lighting,TV and OtherHousehold Appliances And industrial Equipment,Sensors, Wires, Fuses, Phone,Metal Shells, Motors,Lighting, connectors,SMT Maintenance.
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Select a product to estimate shipping.SoPagre’s Sn63/Pb37 solder paste offers a reliable solution for surface mount technology (SMT) soldering needs. This paste is designed for creating strong and durable solder joints across a variety of electronic components.
Key Highlights
- Precise Melting Point: Features a 183°C melting point for controlled soldering and reduced thermal stress.
- Excellent Wetting: Formulated for strong, reliable solder joints with superior wetting properties.
- Versatile Applications: Suitable for use in circuit boards, ICs, BGAs, SMDs, motors, lighting, and other household and industrial equipment.
- Convenient Packaging: Comes in a 50g can, providing a good quantity for various soldering tasks.
Useful Facts
- Manufacturer: SoPagre
- Weight: 2.89 ounces
- Dimensions: 6.77 x 4.21 x 0.87 inches
- Availability: Released October 21, 2025
Good Fit For
- Electronics Repair Technicians
- DIY Electronics Enthusiasts
- SMT Maintenance Professionals
- Hobbyists working on small electronics projects
Product details
| Main Specification | |
|---|---|
| 주요 특징 | SoPagre |
| 주요 특징 | SoPagre |
| 관련 제품 | 1 Set Solder Paste |
| 힘 근원 | NK |
| 제품 무게 | 2.89 온스 |
| Product information | |
| 포장 차원 | 6.77 x 4.21 x 0.87 inches |
| 항목 모델 번호 | MN-1002 |
| Others | |
| 날짜 첫번째 유효한 | 2025년 or 10월 21 |
| 제품 유형 | Solder |